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In the era of 5G, autonomous driving, virtual reality (VR), and the Internet of Things (IoT), the demand for faster and more efficient data transmission is higher than ever. To meet these needs, Copper Innovation Technologies (CIT), a South Korean startup, is pushing the boundaries of high-frequency communication with its next-generation flexible copper-clad laminated film (FCCL). This innovative material is designed to reduce signal loss and enhance data transfer speeds, making it a game-changer for the future of wireless communication.
The 28GHz band, crucial for 5G networks, allows for rapid data transmission, but high-frequency waves are prone to interference from obstacles. CIT’s technology addresses this issue by improving signal efficiency and reducing disruption, paving the way for faster, more reliable data sharing. The key innovation behind this advancement is the use of single crystal copper, where atoms are perfectly aligned, greatly improving electrical performance. This eliminates the noise typically caused by grain boundary scattering, resulting in cleaner, more reliable signal transmission.
According to Interesting Engineering, CIT’s process utilizes substrates like sapphire or magnesium oxide, ensuring the copper forms single crystals while preserving the integrity of the material. The result is a flexible, high-performance film that can be applied to flexible printed circuit boards (PCBs). The flexibility of this material opens up new opportunities for compact designs and more efficient use of space.
One challenge CIT overcame in developing this technology was refining the sputtering process for film deposition. Traditional methods were expensive and caused poor adhesion, but CIT’s approach deposits individual atoms one at a time, improving adhesion and reducing noise during production.
With a strong focus on sustainability, CIT also incorporates recycled copper into its production process. As technologies continue to evolve, CIT’s technology could be significant for the future of high-speed wireless communication.
CIT will showcase its technology at CES 2025 in Las Vegas this January.
